Example of analysis of compounds at the interface between SAC solder and Ni pads.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. 【Overview】 <Elemental Analysis by EDX> ■ Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. <Crystallographic Orientation Analysis by EBSD> ■ By combining it with elemental analysis using EDX, it is possible to estimate the composition. ■ In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.
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